美***Royce全自動(dòng)型芯片拾取系統(tǒng)MP300
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適用于2-12英寸晶圓
• *小200微米芯片拾取
• *適合高、中產(chǎn)能,產(chǎn)能可達(dá)2000UPH
• 可選配芯片轉(zhuǎn)向功能
• 可輸出至2”及4” Tray盤,Wafers, Gel-Pak®, Waffle Pack, 或訂制
Tray
• 采用 Windows XP® 的 DieSort Manager 專業(yè)軟件
• 放置重復(fù)性 +/- 2 mil
• 拾取模式:常規(guī)真空表面接觸或非表面接觸(抓器)
• 10分鐘以內(nèi)快速更換
非表面接觸拾取功能
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Fully automatic MP300 chip pickup system
Suitable for 2-12 inch wafers
• minimum 200 micron chip pickup
• best for high and medium capacity up to 2000UPH
• optional chip steering function
• export to 2 "and 4" trays, Wafers, gel-pak ®, Waffle Pack, or custom
Tray
• use Windows XP® DieSort Manager professional software
• place repeatability +/- 2 mil
• pickup mode: conventional vacuum surface contact or non-surface contact (gripper)
• quick replacement within 10 minutes
Non-surface contact pickup function